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  MLX91208 imc - hall ? current sensor (triaxis ? technology) 3901091208 page 1 of 17 data s heet rev00 4 september 201 5 features and benefits ? programmable high speed current sensor ? tria ? is ? t echnology ? very high sensitivity due to integrated magnetic concentrator ( imc - hall ?) ? wideband: dc to 200 khz ? very short response time : 3 s ? programmable linear transfer characteristic ? selectable analog ratiometric output ? so - 8 package , rohs compliant ? lead free component, suitable for lead free soldering profile 260c (target), msl 3 application examples ? inverter hev and ev ? bldc motor current monitoring ? smart fuse (over - current detection) ? ac/dc converter ? dc/ac converter (inverter) ? dc/dc switched mode power supply ordering information part no. temperature code package option code packing form sensitivity range ( default ) MLX91208 l ( - 40c to 150c) dc (soic) ca l - 000 ( low field ) tu /re (tube /reel ) 100 - 700 mv/m t ( 25 0mv/mt) MLX91208 l ( - 40c to 150c) dc (soic) cah - 000 ( high field ) tu/re (tube/reel) 50 - 300 mv/m t (1 0 0mv/mt) MLX91208 l ( - 40c to 150c) dc (soic) cav - 000 (v. high f.) tu/re (tube/reel) 30 - 200mv/mt (40mv/mt) MLX91208 l ( - 40c to 150c) dc (soic) cav - 001 (v. high f.) tu/re (tube/reel) 30 - 200mv/mt (6 0mv/mt) ordering example: MLX91208ldc - cah - 000 - re 1 functional diagram figure 1 : block diagram
MLX91208 imc - hall ? current sensor (triaxis ? technology) 3901091208 page 2 of 17 data s heet rev00 4 september 201 5 2 general description the mlx9120 8 is a monolithic sensor ic featuring the tria ? is ? hall technology. conventional planar hall technology is only sensitive to the flux density applied orthogonally to the ic surface. the imc - hall ? current sensor is sensitive to the flux density applied parallel to the ic surface. this is obtained through an integrated magneto - concentrator (imc - hall ? ) which is deposited on the cmos die (as an additional back - end step). the imc - hall ? technology is automotive qualified. the product is a single chip hall sensor which provides an output signal proportional to the flux density applied horizontally and is therefore suitable for current measuremen t. it is ideally suited as an open loop current sensor for pcb or bus bar mo unting . it features small size application design and a simple construction for various current ranges from few amperes up to 1000 amperes. the transfer characteristic of the mlx9120 8 is programmable in terms of offset, gain or temperature compensation . the linear analog output is designed for application s where a very fast response is required , such as inverter applications. figure 2 : t ypical application of MLX91208 ( m a g ne tic f ield generated by the current ) .
MLX91208 imc - hall ? current sensor (triaxis ? technology) 3901091208 page 3 of 17 data s heet rev00 4 september 201 5 table of contents 1 functional diagram ................................ ................................ ................................ ................................ ................................ ........ 1 2 general description ................................ ................................ ................................ ................................ ................................ ....... 2 3 glossary of terms ................................ ................................ ................................ ................................ ................................ ......... 4 4 absolute maximum ratings ................................ ................................ ................................ ................................ ............................ 4 5 pin definitions and descriptions ................................ ................................ ................................ ................................ ...................... 4 6 general electrical specifications ................................ ................................ ................................ ................................ ..................... 5 7 magnetic specification ................................ ................................ ................................ ................................ ................................ .... 6 7.1 low field version 10mt (marking xxl) ................................ ................................ ................................ ................................ ..... 6 7.2 high field version 25mt (marking xxh) ................................ ................................ ................................ ................................ ... 6 7.3 very high field version 60mt (marking xxv) ................................ ................................ ................................ ............................ 6 8 analog output specification ................................ ................................ ................................ ................................ ............................. 7 8.1 timing specification ................................ ................................ ................................ ................................ ................................ 7 8.2 accuracy specification ................................ ................................ ................................ ................................ ............................. 8 8.3 remarks to the achievable accuracy ................................ ................................ ................................ ................................ ........ 8 9 programmable items ................................ ................................ ................................ ................................ ................................ ...... 9 9.1 parameter table ................................ ................................ ................................ ................................ ................................ ...... 9 9.2 sensitivity programming (rg, fg) ................................ ................................ ................................ ................................ ........... 9 9.3 offset / output quiescent volt age programming (voq) ................................ ................................ ................................ ............... 9 9.4 output ratiomet ry (enra tio) ................................ ................................ ................................ ................................ .................. 9 sensitivity temperature drift programming (tc1s t, tc2nd_cold, tc2nd_hot) ................................ ................................ ........ 10 9.5 ................................ ................................ ................................ ................................ ................................ ............................ 10 9.6 offset temperature drift programm ing (offdr2c, offdr2h) ................................ ................................ ................................ 10 9.7 noise filter (noisefilt) ................................ ................................ ................................ ................................ ....................... 10 9.8 identification code ( id) ................................ ................................ ................................ ................................ .......................... 10 10 self diagnostic ................................ ................................ ................................ ................................ ................................ ........... 10 11 application information ................................ ................................ ................................ ................................ ............................... 11 11.1 low current measurement 2 - 10a ................................ ................................ ................................ ................................ ....... 11 11.2 medium current measurement up to 50a ................................ ................................ ................................ ............................ 11 11.3 high current measurement up to 1000a ................................ ................................ ................................ .............................. 11 12 recommended application diagrams ................................ ................................ ................................ ................................ .......... 12 12.1 resistor and capacitor values ................................ ................................ ................................ ................................ .............. 12 12.2 pull down resistor for diagnosti c low ................................ ................................ ................................ ................................ ..... 12 12.3 pull up resistor for diagnostic high ................................ ................................ ................................ ................................ ........ 12 13 typical performance ................................ ................................ ................................ ................................ ................................ ... 13 14 standard information regarding manufacturability of melexis products with different soldering processes ................................ ......... 14 15 esd precautions ................................ ................................ ................................ ................................ ................................ ....... 14 16 package information ................................ ................................ ................................ ................................ ................................ .. 15 16.1 soic - 8 package dimensions ................................ ................................ ................................ ................................ .............. 15 16.2 soic - 8 pinout and marking ................................ ................................ ................................ ................................ ................. 15 16.3 soic - 8 hall plate position ................................ ................................ ................................ ................................ ................... 16 soic - 8 imc position and sensor active measurement dimension ................................ ................................ ................................ . 16 16.4 ................................ ................................ ................................ ................................ ................................ ........................... 16 disclaimer ................................ ................................ ................................ ................................ ................................ ...................... 17
MLX91208 imc - hall ? current sensor (triaxis ? technology) 3901091208 page 4 of 17 data s heet rev00 4 september 201 5 3 glossary of terms adc analog to digital converter dac digital to analog converter dnl differential non linearity imc integrated magneto concentrator (imc - hall ? ) inl integral non linearity lsb least significant bit msb most significant bit nc not connected pt c programming through connector tc temperature coefficient in ppm/ c tesla units for the magnetic flux density , 1 mt = 10 gauss 4 absolute maximum r atings parameter symbol value units positive supply voltage (overvoltage) vdd + 10 v reverse supply voltage protection - 0.3 v positive output voltage (1) + 10 v output current iout 7 0 ma reverse output voltage - 0.3 v reverse output current - 50 ma package thermal resistance rth 105 c/w operating ambient temperature range t a - 40 to +1 50 c storage temperature range t s - 55 to + 1 65 c magnetic flux density infinite t table 1 : absolute maximum ratings exceeding the absolute maximum ratings may cause permanent damage. exposure to absolute maximum rated conditions for extended periods may affect device reliability. (1) val id for supply=10v or supply - pin floating 5 p in d efinitions and d escriptions pin # name type function 1 vd ec digital digital supply voltage 3 vss ground supply voltage 4 test/must digital test and factory c alibration 5 vdd supply supply voltage 6 out analog current se nsor o utput table 2 : p in definition and description i t is recommen ded to connect unused pins to the ground for optimal emc results.
MLX91208 imc - hall ? current sensor (triaxis ? technology) 3901091208 page 5 of 17 data s heet rev00 4 september 201 5 6 general electrical specifications operating parameters : t a = - 40 c to 1 25 c, vdd = 4.5 v to 5. 5 v , iout = - 2 ma to +2 ma, recommended application diagram in section 1 , unless otherwise specified . all mentioned component values can have a 20% tolerance . parameter symbol test conditions min typ max units nominal supply voltage vdd 4.5 5 5.5 v supply current idd without output load in application mode t a = - 40 c to 150 c 7 1 2 1 4 ma dc load current iout r load in range [6k, 100k] - 2 2 ma maximum output current (driving capability) imax inside this range, output voltage reaches 3%vdd and 97%vdd - 2 2 ma output resistance vout = 50% vdd, r l = 10k 1 5 ? output capacitive load c load capacitive load range for the stability of the output amplifier. output amplifier optimized for the typical capacitive load. 1 2 10 nf output resistive load r load output resistive load for high linearity (both pull - up and pull - down resistor) 6 k ? output short circuit current i short output shorted to vdd ( permanent ) 35 180 ma output shorted to vss ( permanent ) 35 180 ma output leakage current i leak high impedance mode (1) t = 150c 0.5 1.5 20 ua output voltage swing (linear range) v out_pd pull down 10 k? 10 90 %vdd v out_pu pull up 10 k? 10 90 %vdd high - impedance mode levels ( 1 ) v out_hiz_pu pull - up r l 25 k?, t1 25 c 9 5 %vdd v out_hiz_pd pull - down r l 25 k?, t12 5c 5 %vdd under - voltage detection ( 2 ) v dd_uv d low to high voltage 3 3.3 4 v v dd_uv h hysteresis 0.25 0.3 0.4 v over - voltage detection ( 2 ) v dd_ov d2 low to high voltage 6.7 7.6 v v dd_ov h2 hysteresis 0.05 0.7 v ratiometry enable detection ( 2 ) v ratio_d low to high voltage 4 4.4 5 v v ratio_h hysteresis 0.05 0.5 v table 3 : general electrical parameter (1) refer to chapter self diagnostic , table 10 . (2) according to figure on the right : vout detected voltage hysteresis vdd
MLX91208 imc - hall ? current sensor (triaxis ? technology) 3901091208 page 6 of 17 data s heet rev00 4 september 201 5 7 magnetic specification operating parameters t a = - 40 c to 125 c, vdd = 4.5 v to 5.5 v , unless otherwise specified . 7.1 low field version 10mt (marking xxl) parameter symbol test conditions min typ max units nominal magnetic field range bnom - 7.5 + 7.5 mt operational field range (1) bop - 10 +10 mt linearity error nl b in range bop vout in [10%v dd , 90%v dd ] - 0. 7 +0. 7 %fs hysteresis br b = bop - 10 + 10 ut programmable sensitivity s 100 25 0 7 00 mv/mt sensitivity programming resolution sres 0.1 % table 4 : magnetic specification for 10mt version (low field) 7.2 high field version 25 m t (marking xxh) parameter symbol test conditions min typ max units nominal magnetic field range bnom - 2 0 + 2 0 mt operational field range (1) bop - 2 5 +2 5 mt linearity error nl b in range bop vout in [10%v dd , 90%v dd ] - 0. 7 +0. 7 %fs hysteresis br b = bop - 25 + 25 ut programmable sensitivity s 50 100 300 mv/mt sensitivity programming resolution sres 0.1 % table 5 : magnetic specification for 2 5 mt version ( high field) 7.3 very high field version 6 0mt (marking xxv) parameter symbol test conditions min typ max units nominal magnetic field range bnom - 5 0 + 5 0 mt operational field range (1) bop - 6 0 + 6 0 mt linearity error nl b in range bop vout in [10%v dd , 90%v dd ] - 0. 7 +0. 7 %fs hysteresis br b = bop - 50 + 50 ut programmable sensitivity s cav - 000 cav - 001 3 0 30 40 60 200 200 mv/mt mv/mt sensitivity programming resolution sres 0.1 % table 6 : magnetic specification for 6 0mt version (very high field) (1) outside bop, the imc progressively enters saturation, yielding to an increase of the linearity error .
MLX91208 imc - hall ? current sensor (triaxis ? technology) 3901091208 page 7 of 17 data s heet rev00 4 september 201 5 8 analog output specification 8.1 timing specification operating parameters t a = - 40 c to 1 25 c, vdd = 4.5 v to 5.5 v (unless otherwise specified) . parameter symbol test conditions / comments min typ max units refresh rate trr 0. 8 1 2 s step response time tresp delay between the input signal reaching 90% and the output signal reaching 90%, (2v step at the output, input rise time = 1s) - noise filter off - noise filter on 3 5 4 6 s s bandwidth bw - noise filter off - noise filter on 200 120 250 150 300 180 khz khz power on d elay t pod vout =100% of fs pull - down resistor 100kohm during the power - on delay, the output will remain within the 10% fault band at all time. 1 ms ratiometry cut - off frequency fratio 250 hz table 7 : timing specification for high speed analog output figure 4 : response time definition 1 s i n , v o u t t i m e 9 0 % 1 0 0 % r e s p o n s e t i m e
MLX91208 imc - hall ? current sensor (triaxis ? technology) 3901091208 page 8 of 17 data s heet rev00 4 september 201 5 8.2 accura cy specification operating parameters t a = - 40 c to 1 25 c, vdd = 4.5 v to 5.5 v (unless otherwise specified) . parameter symbol test conditions min typ max units thermal offset drift t voq offset drift referred to 25c s=40mv/mt (xxv version) s= 100mv/mt ( xxh version ) s= 250mv/mt ( xxl version) vdd=5v tc = 0 ? 150 ppm/ c voq = 50 ? 0.2 %vdd - 10 + 10 mv thermal offset drift resolution t voqres 0. 0 75 mv /c thermal sensitivity drift tc - 1.5 0 + 1.5 % of s thermal sensitivity drift r esolution tcres 40 ppm/ c rms output noise n rms s=40mv/mt (xxv version) s=100mv/mt (xxh version) s=250mv/mt (xxl version) - noise filter off - noise filter on 0.2 0.12 %vdd %vdd ratiometry error offset voq voq = 50%vdd vdd = 10%vdd - 0.4 +0.4 % of voq ratiometry error sensitivity s vdd = 10%vdd - 0.4 +0.4 % of s table 8 : accuracy - specific parameters 8.3 remarks to the achievable accuracy the a chievable t arget a ccuracy depends on the u ser end of line calibration. the resolution for the offset and offset drift calibration is better than 0.1%vdd. trimming capability is h igher than measurement accuracy. end user calibration can increase the accura c y of the syst em.
MLX91208 imc - hall ? current sensor (triaxis ? technology) 3901091208 page 9 of 17 data s heet rev00 4 september 201 5 9 programmable i tems 9.1 p arameter tab le parameter bits comment voq[11:0] 12 quiescent output level (0 g auss) adjustment rg[2:0] 3 rough gain adjustment fg[9:0] 10 fine gain adjustment enratio 1 ratiometry enablement tc1[7:0] 8 adjustment of the first order temperature compensation of the magnetic sensitivity tc2hot[4:0] 5 adjustment of the extra temperature compensation of the magnetic sensitivity at high temperature tc2cold[4:0] 5 adjustment of the extra temperature compensation of the magnetic sensitivity at low temperature offdr2c[5:0] 6 adjustment of the offset drift at low temperature after the vga offdr2h[5:0] 6 adjustment of the offset drift at high temperature after the vga noisefilt 1 noise filter enablement crc[15:0] 16 16 - bit crc for the checksum calculation of the configuration register. id[47:0] 48 customer identification code table 9 : customer programmable items 9.2 sensitivity programming (rg, fg ) the sensitivity can be programmed from 50 to 300mv/mt (high field version) or 100 to 700mv/mt (low field version), with the roughgain (3 bits) and finegain (10 bits) parameters. 9.3 offset / o utput quiescent voltage programming ( voq ) the offset is programmable with 12 bits in 1. 5 mv steps over the full output range. this corresponds to a calibration resolution of 0. 03 %vdd. the typical step size would be 5v/4096 = 1.22 mv, but the actual step size can differ from the nominal value because of internal gain tolerance. a maximum step size of 1.5 mv is guaranteed . note: for optimal performance over temperature, the voq should be programmed in the range from 2 to 3v. 9.4 output ratiometry ( enratio ) the ratiometry of the output v er s us the supply can be disabled by setting this bit to 0 . note : f or optimal performance over temperature, the ratiometry setting should not be changed on customer side. by default, this setting is enabled during final test calibration .
MLX91208 imc - hall ? current sensor (triaxis ? technology) 3901091208 page 10 of 17 data s heet rev00 4 september 201 5 9.5 sensitivity temperature drift programming (tc1st, tc2nd _cold, tc2nd_hot ) first order sensitivity temperature drift can be trimmed with tc1. the programming resolution is 40ppm/k. second order sensitivity temperature drift can be trimmed with tc2cold and tc2hot. the programming r esolution is 2 ppm/k 2 for tc2cold and 0.6ppm/k 2 for tc2hot.the second order can also be seen as third order correction since cold and hot sides are independe ntly adjusted. note: for optimal performance over temperature, the first order sensitivity drift compensation (tc1st) should not exceed 250ppm/k. 9.6 offset temperature drift programming (offdr2c, offdr2h) offset temperature drift caused by the output amplifier can be compensated with these two parameters . this first order correction is done independently for temperatures over and below 25 c. note: two additional parameters ( offdr1c , offdr1h ) are calibrated by melexis to compensate for the offset temperature drift caused by the hall element (before the variable gain amplifier). these parameters should not be adjusted on customer - side. 9.7 noise filter (noisefilt) setting this bit to 1 enables the noise filter, reducing noise and increasing response time. 9.8 identification code ( id) 48 bits programmable identification code . 10 self diagnostic the mlx 91208 provides self diagnostic features to detect internal memory errors and over - / under - voltage . those features increase the robustness of the ic functionality , as they prevent the ic from providing erroneous output signal in case of internal or external failure modes . error action effect on outputs remarks calibration data crc error (at power up and in normal working mode) fault mode high impedance mode pull down resistive load => diag low pull up resistive load => diag high power on delay high impedan ce mode 5 ms max in high impedance followed by settling undervoltage mode ic is reset high impedan ce mode 300mv hysteresis (typical) overvoltage detection ic is reset high impedance mode 100mv hysteresis (typical) table 10 : self diagnost ic
MLX91208 imc - hall ? current sensor (triaxis ? technology) 3901091208 page 11 of 17 data s heet rev00 4 september 201 5 11 application information please refer to our current sensor reference design guide for more application information: http://melexis.com/assets/current - sensors - reference - designs - 6187.aspx 11.1 low current measurement 2 - 10a low currents can be measured by either using a multi - turn/multi - layer pcb where the current is allowed to flow several times under the sensor, or by add ing a closed ferromagnetic shield around the current trace with a small air gap to concentrate the magnetic flux above the sensor. figure 3 : low current application s with either multi - trace/multi - layer pcb (left) or closed shield (right). 11.2 medium current measurement up to 50a for medium currents, a single pcb trace can be used. the sizing of the pcb trace should take in to account the current handling capabilit y and the total power dissipation . the pcb trace should be thick and wide enough to handle the rms current continuously. a simple u - shaped ferromagnetic shield is often required to protect the sensor from cross - talk or external stray fields , if they cannot be cancelled - out by other means (peak - peak detection, etc.). figure 4 : medium current application on pcb 11.3 high current measurement up to 1000a for high currents flowin g in a bus bar, MLX91208 is typically assembled on a pcb lying immediately above the current conductor. a ferromagnetic shield is usually added to protect the sensor from external fields and ensure good homogeneity of the magnetic flux, for optimal robustness against vibrations and mechanical tolerances. figure 5 : high current application on bus bar
MLX91208 imc - hall ? current sensor (triaxis ? technology) 3901091208 page 12 of 17 data s heet rev00 4 september 201 5 12 recommended application diagrams 12.1 resistor and capacitor values part description value unit c1 supply capacitor, emi, esd 100 nf c2 decoupling, emi, esd 2 - 10 (1) nf c3 decoupling, emi, esd 47 nf r1 pull up or pull down resistor 6 - 100 k table 11 : resistor and capacitor values (1) 10nf is recommended for better emc and esd performance . 12.2 pull down resistor for diagnostic low figure 6 : diagnostic low 12.3 pull up resistor for diagnostic high figure 7 : d iag nostic high 5 o u t v d d v s s t e s t 6 7 8 4 3 2 1 m l x 9 1 2 0 8 s u p p l y v o l t a g e a n a l o g o u t p u t g n d c 2 r 1 c 1 c 3 v d e c 5 o u t v d d v s s t e s t 6 7 8 4 3 2 1 m l x 9 1 2 0 8 s u p p l y v o l t a g e a n a l o g o u t p u t g n d c 2 r 1 c 1 c 3 v d e c
MLX91208 imc - hall ? current sensor (triaxis ? technology) 3901091208 page 13 of 17 data s heet rev00 4 september 201 5 13 typical performance figure 8 : thermal sensitivity drift. figure 9 : thermal offset drift . figure 10 : linearity error for all version s . figure 11 : response time with noise filter off. figure 12 : response time with noise filter on. shunt MLX91208 shunt MLX91208
MLX91208 imc - hall ? current sensor (triaxis ? technology) 3901091208 page 14 of 17 data s heet rev00 4 september 201 5 14 standard information regarding manufacturability of melexis products with different soldering processes melexis devices are qualified using state - of - the - art practices in accordance with automotive and environmental requirements. through qualifications, various soldering techniques are considered; please refer to soldering recommendations for melexis products for more information : ( http://www.melexis.com/asset/soldering _application_note_and_recommendations_downloadlink_5446.aspx ). for components normally soldered using surface mounted device techniques (eg: reflow process), melexis has defined and qualified moisture sensitivity level and peak temperature in accordance with the jedec j - std - 020 standard. delivered material is conditioned accordingly. moisture sensitivity level and peak temperature information can be found on the label identifying the material. in case you intend to use a reflow soldering proce ss for through hole devices (melexis package codes: sa, ua, va, vk, vm), please contact melexis to verify your soldering process compatibility. the application of wave soldering for smds is allowed only after consulting melexis regarding assurance of ad hesive strength between device and board. based on melexis commitment to environmental responsibility, europe legislations (direction on the restriction of the use of certain hazardous substances, rohs) and customer requests, melexis has deployed pb free leadfinish (typically matte tin) on all assp products. for through hole devices (melexis package codes: sa, ua , va, vk, vm) trim&form, please refer to trim & form recommendations for melexis products for more information : ( http://www.melexis.com/assets/trim_and_form_recommendations_downloadlink_5565.aspx ) 15 esd precautions electronic semiconductor products are sensitive to electro static discharge (esd). always observe electro static discharge control procedures whenever handling semiconductor products. esd hbm robustness is 2kv on external pins according to aec - q100 - 002 rev - d.
MLX91208 imc - hall ? current sensor (triaxis ? technology) 3901091208 page 15 of 17 data s heet rev00 4 september 201 5 16 package information 16.1 soic - 8 package dimensions figure 13 : soic - 8 package dimensions 16.2 soic - 8 pinout and marking figure 14 : soic - 8 pinout and marking ( very high field, high field and low field version) very high field version y ywwv p 0 . 1 9 0 . 2 5 n o t e s : a l l d i m e n s i o n s a r e i n m i l l i m e t e r s ( a n l g e s i n d e g r e e s ) . * d i m e n s i o n d o e s n o t i n c l u d e m o l d f l a s h , p r o t r u s i o n s o r g a t e b u r r s ( s h a l l n o t e x c e e d 0 . 1 5 p e r s i d e ) . * * d i m e n s i o n d o e s n o t i n c l u d e i n t e r l e a d s f l a s h o r p r o t r u s i o n ( s h a l l n o t e x c e e d 0 . 2 5 p e r s i d e ) . * * * d i m e n s i o n d o e s n o t i n c l u d e d a m b a r p r o t r u s i o n . a l l o w a b l e d a m b a r p r o t r u s i o n s h a l l b e 0 . 0 8 m m t o t a l i n e x c e s s o f t h e d i m e n s i o n a t m a x i m u m m a t e r i a l c o n d i t i o n . d a m b a r c a n n o t b e l o c a t e d o n t h e l o w e r r a d i u s o f t h e f o o t . 5 . 8 4 6 . 2 0 * * 1 . 2 7 t y p 4 . 8 0 4 . 9 8 * 1 . 5 5 1 . 7 3 0 . 1 2 7 0 . 2 5 0 1 . 4 0 1 . 5 5 0 . 3 5 0 . 4 9 * * * 3 . 8 1 3 . 9 9 * * 0 8 0 . 4 1 0 . 8 9
MLX91208 imc - hall ? current sensor (triaxis ? technology) 3901091208 page 16 of 17 data s heet rev00 4 september 201 5 16.3 soic - 8 hall plate position figure 15 : soic - 8 hall plate positioning 16.4 soic - 8 imc position and magnetic sensitive direct ion figure 16 : imc position and geometry for low - field version figure 17 : imc position and geometry high - field version figure 18 : imc position and geometry very high - field version 1 . 8 5 2 . 1 5 2 . 3 5 2 . 5 5 0 . 4 6 + / - 0 . 0 6 b e x t e r n b e x t e r n b e x t e r n b e x t e r n
MLX91208 imc - hall ? current sensor (triaxis ? technology) 3901091208 page 17 of 17 data s heet rev00 4 september 201 5 disclaimer devices sold by melexis are covered by the warranty and patent indemnification provisions appearing in its term of sale. melexis makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. melexis reserves the right to change specifications and prices at any time and without notice. therefore, prior to designing this product into a sy stem, it is necessary to check with melexis for current information. this product is intended for use in normal commercial applications. applications requiring extended temperature range, unusual environmental requirements, or high reliability applications , such as military, medical life - support or life - sustaining equipment are specifically not recommended without additional processing by melexis for each application. the information furnished by melexis is believed to be correct and accurate. however, mele xis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kin d, in connection with or arising out of the furnishing, performance or use of the technical data herein. no obligation or liability to recipient or any third party shall arise or flow out of melexis rendering of technical or other services. ? 2009 melexis nv. all rights reserved. for the latest version of this document, go to our website at www.melexis.com or for additional information contact melexis direct: europe, africa, asia: america : phone: +32 1367 0495 phone: +1 603 223 2362 e - mail: sales_europe@melexis.com e - mail: sales_usa@melexis.com iso/ts 16949 and iso14001 certified


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